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Improving thermal interface materials through the liquid component
Thermal interface materials for thermal conduction of excess heat from microelectronics have been developed and evaluated. The optimum carbon black content of the thixotropic paste based on polyol ethers is 2.40 vol.%. The ...
Carbon and related materials for thermal and electrical applications
High thermal stability has been attained in polyol ester by using a sterically half-hindered phenolic primary antioxidant and a thiopropionate secondary antioxidant. Carbon black and boron nitride (BN) serve as antioxidants ...