Improving thermal interface materials through the liquid component
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Thermal interface materials for thermal conduction of excess heat from microelectronics have been developed and evaluated. The optimum carbon black content of the thixotropic paste based on polyol ethers is 2.40 vol.%. The resulting thermal contact conductance is 30 x 10 4 W/m 2 .°C for mating surface roughnesses of 0.05 mm. Carbon black pastes are also effective as coatings for improving the performance of thermal gap-filling materials. Polyol-based phase-change materials, including a diol with 4 vol.% boron nitride, exhibit higher thermal contact conductance and higher thermal stability than conventional phase change materials. Moreover, a high thermal stability has been attained by using polyol esters with a half-hindered phenolic primary antioxidant and a thiopropionate secondary antioxidant, along with either carbon black or boron nitride particles. Both solid components serve as antioxidants in the presence of either primary antioxidant or secondary antioxidant, but they hinder the synergistic effect between primary and secondary antioxidants.