A thermodynamic framework for damage mechanics of electromigration and thermomigration
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A thermodynamic damage model is proposed for investigation of electromigration failure process. General finite element program has been developed for simulation of electromigration process based on the damage model. Stress gradient, thermogradient, temperature field and electric field have been taken into account and also plastic strain is included in the program. The simulations conducted on copper and aluminum thin film and solder joint connections proved the effectiveness of the program with direct comparison with experimental results.